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TFS 4700 UHV
Sputtering Systems
Designed
for reactive, sequential and
co-deposition Proven system for UHV sputter deposition of metals and insulators on 2" or 3" wafers Water cooled, 304 stainless steel, 400mm diameter deposition chamber Four magnetron sources with 2" or 3" diameter targets Substrate manipulator for one 2" substrate, heating to 900°C, rotating to 100 rpm with either DC or RF bias (maximum 200W RF power) Sample transfer with or without substrate holder Turbo pumped fast entry load lock EpiSoftTM automatic process control compatible
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System
Features
