Specifications - UHV Sputtering Systems
TFS 4700

Deposition Chamber

550 l/s wide range turbo pump with splinter shield, air cooling kit, heater band and fixed delay vent valve backed by 4 m/hr diaphragm pump. Base pressure of <8x10^-10 mbar. Bakeable capacitance manometer (2, 5, 10 or 100 mbar full scale) and bakeable ion gauge head. Film thickness rate monitor with bakeable sensor head. Pneumatic gate valve with a 3 position cylinder allowing operation to fully open, fully closed or a pre-set throttle position, set by manual micrometer.

Load Lock

70 l/s wide range turbo pump with splinter shield, air cooling kit, heater band and fixed delay vent valve backed by 2 m/hr diaphragm pump. Base pressure of <1x10^-8 mbar. Bakeable inverted magnetron gauge head on the load lock.

Magnetrons

2" or 3" diameter targets powered by 500W DC, 1000W DC or 600W RF (including auto tuning) power supplies. Bakeable to 180°C with magnets attached. Pneumatically operated, bellows sealed, sputter source shutters.

Substrate manipulator

Rotary drive with DC servo motor for continuous rotation of the substrate during deposition. Manual Z shift for adjustment of the height between the substrate and the sources, and for substrate transfer, with X and Y shift for transfer alignment. Eurotherm temperature control system based manipulator heater control.

Automatic Pressure Control

Deposition upstream pressure control system for two different gas inlet lines.